I-HTE High Temperature Elongation Copper Foil

Ukutyeba: 12um 15um 18um 35um 70um 105um

Ububanzi obuqhelekileyo: 1290mm, inokusika njengesicelo sobungakanani

Iphakheji yebhokisi yomthi


Iinkcukacha zeMveliso

Iithegi zeMveliso

Iinkcukacha

Ukutyeba: 12um 15um 18um 35um 70um 105um
Ububanzi obuqhelekileyo: 1290mm, inokusika njengesicelo sobungakanani
Iphakheji yebhokisi yomthi
Umgangatho usekelwe kwi-GB/T5230-1995 kunye ne-IPC-4562standard
I-ID: 76 mm, 152 mm
Ubude: Yenzelwe wena
Isampuli inokubonelelwa

Iimbonakalo

Inkampani iphuhlise i-foil-grain-grain kunye ne-high-high-forth-forth copper foil ye-rough surface ephantsi kunye nokusebenza kwe-high-temperature ductibility.Le foyile ibonakalisa iinkozo ezilinganayo kunye nokwandiswa okuphezulu kwaye kunokuthintela iifassures ezibangelwa uxinzelelo lwe-thermal, ngaloo ndlela ifanelekile kwiindidi zangaphakathi nangaphandle zebhodi eninzi.Ngomgangatho ophantsi woburhabaxa bomphezulu kunye nokuqhawuka okugqwesileyo, kuyasebenza kuxinaniso oluphezulu kunye nokubhitya.Ngamandla okuqina agqwesileyo, inceda ukuphucula ukuguquguquka kwaye isetyenziswa ikakhulu kwi-PCB ye-multilayer kunye ne-flex plate.Ngokomelela okugqwesileyo kunye nokuqina, ayikrazuki lula emphethweni okanye ekugotyweni, iphucula kakhulu izinga lokuthotyelwa kwemveliso.

Ifoyile ephathwayo engwevu okanye ebomvu
Amandla amaxolo aphezulu
Ukuchaneka okulungileyo
Ukumelana nokugqwesa okugqwesileyo
Ukuqhekeka kwefoyile echasene nobude obuphezulu kumaqondo obushushu aphakamileyo
Ubude obuphezulu emva kokunyangwa ngobushushu obuphezulu okanye i-annealing.
Phakamisa Ipropati.
Ukuphumelela ekuthinteleni ipleyiti yokuqhekeka.

Isicelo

Ibhodi yePolyimide
Ibhodi ye-epoxy
CEM-3, FR-4, FR-5, Hydrocarbon substrate
Ibhodi yemultilayer
I-Tg ephakamileyo, i-lead-free kunye ne-halogen-free, i-Middle Tg
Ukumelana ne-coefficient yeqondo lokushisa elihle

Iimpawu eziqhelekileyo zoBubushushu obuphezulu Elongation Copper Foil

Ukuhlelwa

Iyunithi

Imfuneko

Indlela yoVavanyo

Ubukhulu begama

Um

12

18

35

70

105

IPC-4562A

Ubunzima beNdawo

g/m²

107±5

153±7

285± 10

585± 20

870±30

IPC-TM-650 2.2.12.2

Ubunyulu

%

≥99.8

IPC-TM-650 2.3.15

uburhabaxa

Icala elikhanyayo (Ra)

սm

≤0.43

≤0.43

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Icala leMatte(Rz)

um

≤6

≤8

≤10

≤15

≤20

Tensile strength

RT(23°C)

Mpa

≥207

≥207

≥276

≥276

≥276

IPC-TM-650 2.4.18

HT(180°C)

≥103

≥103

≥138

≥138

≥138

Elongation

RT(23°C)

%

≥2

≥2

≥3

≥3

≥4

IPC-TM-650 2.4.18

 

HT(180°C)

≥2

≥2

≥2

≥3

≥3

Rukunyamezela

Ω.g/m²

≤0.17

≤0.166

≤0.16

≤0.162

≤0.162

IPC-TM-650 2.5.14

Amandla ePeel(FR-4)

N/mm

≥0.9

≥1.1

≥1.4

≥2.0

≥2.0

IPC-TM-650 2.4.8

 

lbs/in

≥5.1

≥6.3

≥8.0

≥11.4

≥11.4

Pinholes & porosity

Inani

No

IPC-TM-650 2.1.2

Umchasi-oxidization

RT(23°C)

 

180

 

RT(200°C)

 

40

 

Ububanzi boMgangatho, 1295 (±1) mm, Ububanzi: 200-1340mm.Ngamana ngokungqinelana nesicelo somthengi.
Sivavanya amandla e-peel nge-FR-4(Tg140) prepreg, nceda uphinde uqinisekise nge-pp yakho.

I-5G High frequency Board I-Ultra Low Profile Copper Foil1

  • Ngaphambili:
  • Okulandelayo:

  • Bhala umyalezo wakho apha kwaye uwuthumele kuthi