Iprofayile yeFoyile yoKhopolo ePhantsi kakhulu (VLP-SP/B)

Unyango lwe-sub-micron-roughening yonyusa kakhulu indawo engaphezulu ngaphandle kokuchaphazela uburhabaxa, nto leyo eluncedo kakhulu ekwandiseni amandla okuncamathela.


Iinkcukacha zeMveliso

Iithegi zeMveliso

Unyango lwe-sub-micron-roughening yonyusa kakhulu indawo engaphezulu ngaphandle kokuchaphazela uburhabaxa, nto leyo eluncedo kakhulu ekwandiseni amandla okuncamathela.Ngokubambelela kwi-particle ephezulu, akukho kukhathazeka ngamaqhekeza awela kunye nemigca engcolileyo.Ixabiso le-Rzjis emva kokwenziwa rhabaxa ligcinwa kwi-1.0 µm kwaye ukungafihli kwefilim emva kokuba icutshiwe nako kulungile.

Iinkcukacha

Ukutyeba: 12um 18um 35um 50um 70um
Ububanzi obusemgangathweni: 1290mm, ububanzi: 200-1340mm, bunokunqunyulwa ngokwesicelo sobukhulu.
Iphakheji yebhokisi yomthi
I-ID: 76 mm, 152 mm
Ubude: Yenzelwe wena
Isampuli inokubonelelwa

Iimbonakalo

Ifoyile enyangweyo ipinki okanye imnyama yefoyile yobhedu ye-electrolytic enoburhabaxa obuphantsi kakhulu.Xa kuthelekiswa nefoyile yobhedu ye-electrolytic eqhelekileyo, le foil ye-VLP ineekristale ezigqwesileyo, ezilinganayo ezineenduli ezisicaba, ezinoburhabaxa bomphezulu obuyi-0.55μm, kwaye zineemfanelo ezifana nokuzinza kobukhulu obungcono kunye nobunzima obuphezulu.Le mveliso isebenzayo kwi-high-frequency kunye ne-high-speed materials, ngokukodwa iibhodi zeesekethe eziguquguqukayo, iibhodi zeesekethe eziphezulu, kunye neebhodi zesekethe ze-ultra-fine.
Iprofayile ephantsi kakhulu
I-MIT ephezulu
Etchability egqwesileyo

Isicelo

2 umaleko 3 FPC
EMI
Ipateni yesekethe entle
Imfonomfono Ukutshaja okungenazintambo
Ibhodi yefrikhwensi ephezulu

Iimpawu eziqhelekileyo zeProfayili yeCopper Foil ephantsi kakhulu

Ukuhlelwa

Iyunithi

Imfuneko

Indlela yoVavanyo

Ubukhulu begama

Um

12

18

35

50

70

IPC-4562A

Ubunzima beNdawo

g/m²

107±5

153±7

285± 10

435±15

585± 20

IPC-TM-650 2.2.12.2

Ubunyulu

%

≥99.8

IPC-TM-650 2.3.15

uburhabaxa

Icala elikhanyayo (Ra)

սm

≤0.43

IPC-TM-650 2.3.17

Icala leMatte(Rz)

um

≤3.0

≤3.0

≤3.0

≤3.0

≤3.0

Tensile strength

RT(23°C)

Mpa

≥300

IPC-TM-650 2.4.18

HT(180°C)

≥180

Elongation

RT(23°C)

%

≥5

≥6

≥8

≥10

≥10

IPC-TM-650 2.4.18

HT(180°C

≥6

≥6

≥6

≥6

≥6

Amandla ePeel(FR-4)

N/mm

≥0.8

≥0.8

≥1.0

≥1.2

≥1.4

IPC-TM-650 2.4.8

lbs/ngaphakathi

≥4.6

≥4.6

≥5.7

≥6.8

≥8.0

Pinholes & Porosity Amanani

No

IPC-TM-650 2.1.2

Umchasi-oxidization RT(23°C) Days

180

 
HT(200°C)

Imizuzu

30

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I-5G High frequency Board I-Ultra Low Profile Copper Foil1

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